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Alan Cheslow
Samsung slims down NAND memory packaging, wafer-thin gadgets to follow - http://www.engadget.com/2009...
November 6
from Bookmarklet
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"Korean memory maker has now successfully halved the thickness of its octa-die memory package to a shockingly thin 0.6mm (or 0.02 inches). The new stacks will start out at a 32GB size"
- Alan Cheslow
from Bookmarklet