IBM opens up smartphone, tablet support for its workers -
Why States Don’t Want New Engineering Colleges Anymore? -
CFN Lectures on Functional Nanostructures - Volume 2: Nanoelectronics (repost) -
Micron signs STT-MRAM research deal -
Ubuntu and Dell rekindle their love, in China -
Xilinx shipping new 2.5D Interposer with stacked FPGA built on TSMC 28nm process -
LSI Announces Agreement to Acquire SandForce -
Lubelskie uczelnie stawiają na współpracę z Chinami -
IBM announces Virginia Rometty as new CEO -
Cadence CEO: Chip execs eye China, India -
Robots and automated cars will require our cities to become machine-readable -
Google + will not dethrone Facebook because my mom doesn’t use it -
RRAM set to follow 3-D flash, says IMEC -
Imec demonstrates CMOS integrated poly-SiGe piezoresistive pressure sensor -
Altatech Semiconductor’s 300 mm CVD system being used in 3D IC pilot production at ASSID -
ARM, UMC partnership extends to 28nm tech -
Oki Semiconductor becomes Lapis -
Building a $36.5 million business with open source software -
Infineon succeeds in producing chips on new 300-millimeter thin wafer technology for power semiconductors -
Erstes Android-Smartphone von Medion bei Aldi -
Ask HN: What data structure does our brain use? -
Samsung, Micron back new memory type to challenge DDR3 -
Szwajcaria wspiera polskie regiony -
Atmel launches smallest low-frequency RF IDIC package -
ARM, UMC extend partnership to 28-nm -
W.R. Curtice Consulting Homepage -
X-FAB Qualifies Cadence Physical Verification System for All Process Nodes -
Crocus signs IBM as MRAM partner -
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